Xiaomi XRING O2 leak hints that this 3nm chip is coming this year. Learn all about the upcoming Xiaomi in-house processor here.

This year, we’re still seeing a lot of chips built on the 3nm process. However, that is expected to change in 2026. Thanks to the advancements TSMC has made, we can look forward to chips built on the ...

The 3nm building blocks include high-speed SerDes and parallel interconnects for dramatically boosting the performance of next-generation data infrastructure Innovative die-to-die interconnects will ...

In the current world of chip manufacturing, reaching smaller process nodes like 3nm is a huge technological flex. Samsung has been a key player, pushing the boundaries with its 3nm processor ...

Apple feels the heat - significantly reduces its advanced chip order with TSMC. The 3nm chip will be very expensive. TSMC is one of the major players in the chip foundry business. The Taiwanese ...

Renesas Electronics has announced a new ternary content‑addressable memory (TCAM) technology built on a 3nm FinFET process.

At MWC 2026, Qualcomm introduced the Snapdragon Wear Elite platform, signalling a fresh push into premium wearable silicon. The new chip is aimed at upcoming Wear OS smartwatches, including future ...

Apple’s M5 MacBook Pro, powered by the innovative M5 chip, establishes a new standard for high-performance laptops. Built using advanced 3nm process technology, the M5 chip introduces substantial ...

Xiaomi's second-generation in-house mobile processor, the Xring O2, will skip TSMC's 2nm process and instead use the company's 3nm N3P node, underscoring a trade-off between performance, cost, and ...

M31 Technology (M31), a global leader in silicon intellectual property (IP), today announced that the silicon-proven MIPI M-PHY v5.0 IP has been validated on an advanced 4nm process node and is ...

Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs ...