Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...
Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...
Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...
The International Test Conference is the electronic industry’s premier event dedicated to the testing of devices, boards, and systems, from design verification to final testing. At this year’s version ...
ASML (NASDAQ:ASML) reigns supreme in the semiconductor equipment world, holding a virtual monopoly on extreme ultraviolet (EUV) lithography machines essential for crafting the most advanced chips.
SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...
The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant ...
Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
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