SlimCell(TM) ECP System's Individual-Cell Chemistry Enables Industry's First Multi-Step Copper Plating Capability for 65nm and Beyond Copper Chips Applied Materials, Inc. introduces its 300mm SlimCell ...

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less ...

Electroplating is a technique that uses an electrical current to deposit a thin layer of metal onto a surface. It is widely used across industries to enhance material properties, such as durability, ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

MAINBOARD-LISTED Nico Steel Holdings on Monday said it has received approval for its patent on the electroplating process of an aluminium alloy with copper, for a period of 20 years, starting from ...