AI infrastructure can't evolve as fast as model innovation. Memory architecture is one of the few levers capable of accelerating deployment cycles. Enter SOCAMM2 ...

Sandisk and SK hynix push High Bandwidth Flash (HBF) standard via OCP to cut AI inference costs and boost scalability.

Sandisk (NasdaqGS:SNDK) and SK hynix have agreed to work together to standardize and commercialize High Bandwidth Flash technology. The partnership targets the growing demand from AI inference ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Sandisk and SK hynix have agreed to work together on standardizing and commercializing High Bandwidth Flash (HBF) technology for AI inference workloads. The collaboration focuses on creating a common ...

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of a new standard for Standard Package ...

Samsung Electronics is expected to gain an edge in supplying high-performance high-bandwidth memory 4 (HBM4) to Nvidia, as the U.S. artificial ...

AMD’s Fuji was one of the first GPUs to use JEDEC’s High Bandwidth Memory (HBM) DRAM standard and now JEDEC has released an update which should attract others. JEDEC has announced an update to ...

Samsung has commenced mass production on its next-generation high bandwidth memory (HBM) product, HBM4. According to Samsung, the firm leveraged its 6th-generation 10 nanometer (nm)-class dynamic ...