Broader graphical coverage and flexibility improve readability and user control across complex system models SysML v2 ...

Back in 2010, I was part of a group of contributors to Scenery by the Seasons by Kalmbach Publishing Co. The 98-page book featured stories on modeling seasons on your layout. Among the topics covered ...

IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...

Before 3D modeling, the only way of finding interference was by looking at two dimensional drawings or 2D models. Unfortunately, some problems were not found until construction was underway. Engineers ...

A layout-dependent circuit-design model from Toshiba helps boost gate density and improve cost-performance in next-generation 45-nm CMOS technology. More specifically, 45-nm CMOS gate density can be 2 ...

Microelectromechanical systems (MEMS) are rapidly becoming an indispensable part of the design and fabrication of intelligent systems. Bridging the gap between the physical world and the electronic ...