Semiconductor Engineering

Multi-Tier Die Stacking Enables Efficient Manufacturing

Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die ...
Semiconductor Engineering

Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding

A technical paper titled “Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding” was published by researchers at imec, Brewer Science and SUSS MicroTec Lithography GmbH. “A collective ...
Seeking Alpha

Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation

Certified digital and analog flows on the TSMC N2P and A16™ processes using TSMC NanoFlex™ architecture boost performance and speed analog design migration 3DIC Compiler platform and 3D-enabled IP ...
MIT Technology Review

Multi-die systems define the future of semiconductors

Multi-die system or chiplet-based technology is a big bet on high-performance chip design—and a complex challenge. In partnership withSynopsys To say that semiconductor technology is part of the ...
Seeking Alpha

Synopsys and Samsung Foundry Deepen Collaboration to Accelerate Multi-Die System Design for Advanced Samsung Processes

Synopsys IP and Certified EDA Design Reference Flow Speed Heterogeneous Integration on SF5/4/3 Nodes "Semiconductor designers are dealing with new levels of complexity as they develop high-performance ...
Design-Reuse

Visualizing Cross-Die Paths in Multi-Die Designs

With an unprecedented need for ever-increasing performance, scalability, high-yield, and heterogeneous integration, HPC, AI/ML, and automotive chip designers are turning to multi-die design ...