PulseForge’s flux-less approach overcomes these limitations by leveraging the unique physics of Photonic Soldering, where rapid heating significantly limits oxygen penetration during reflow. The ...

KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take ...

Vacuum reflow soldering technology, although limited in adoption, is emerging as a key focus in high-reliability electronics.

STI announced on the 4th that it has received an order for reflow equipment from a global semiconductor company. The reflow equipment ordered by STI is for the 4th generation High Bandwidth Memory ...

Access our Reader Service Web site to quickly find and request information on products and services found in the pages of Machine Design. Through-hole reflow (THR) is a recently developed method of ...

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the ...

FCI extends its reflow process-compatible D-Sub family of connectors by introducing a new right-angle version for Pin-In-Paste (through-hole) technology. This product line extension will allow ...